Chemical Metrology

Nova leverages a wide range of advanced chemical metrology analysis techniques designed to measure and analyze multiple metals and compounds of increasing complexity. The company’s cutting-edge techniques analyze the chemical composition of materials in electrochemical plating and e-less plating baths across back-end wafer-level packaging, frontend dual-damascene process steps, advanced substrate and PCB plating processes.

Harnessing over two decades of technological excellence and leadership from recently acquired ancosys GmbH, Nova offers both industry-standard and unique technologies to provide the insight required to meet stringent material purity and quality demands. The company’s flexible architecture enables various techniques like HPLC, CVS, titration, and optical spectroscopy to be installed together, and be easily field-upgradeable in a coordinated manner, with process control capabilities such as component dosing, bleed and feed, bath make-up, and replenishment.

Enabling customers to measure and control the chemical composition of ECP baths across the entire manufacturing process, Nova’s leading technologies help reduce operating costs, lower total cost of ownership, reduce environmental burden of semiconductor manufacturing process and increase yield for the end customer.