Nova VeraFlex® IV

System enhancements have been developed for increasing X-ray flux that generates higher photoelectron count rates and faster processing. This offers substantial throughput improvements while maintaining precise measurement performance.

Designed with enhanced X-ray beam alignment and control for smaller next-generation pad sizes, in-line measurements can be taken both in the scribe line and in-die on-device.

Both XPS and LE-XRF measurements can occur simultaneously for inline and in-die applications, offering unique metrology solutions for critical yield-driving applications.

Beam parameters from the electron gun and the generated X-ray beam energy are continuously monitored enabling uninterrupted high-volume manufacturing.

Machine learning capabilities enhancing the throughput and precision performance of new or established applications and maximize system productivity.