Please join us and our partners to the following lectures:

27 February, 3:40 PM: Full wafer OCD metrology: Increasing the sampling rate without the cost of ownership penalty by Bhargava Ravoori, Intel Corp. (USA)

Session 3 | Optical Metrology

27 February, 4:20 PM: TSV strain evolution mapping using in-line Raman spectroscopy by Stefan Schoeche, IBM Thomas J. Watson Research Ctr. (USA)

Session 3 | Optical Metrology

2 March, 3:40 PM: 300mm in-line metrologies for the characterization of ultra-thin layer of 2D materials by Alain Moussa, imec (Belgium)

Session 14 | Late Breaking News

Don’t miss the opportunity to attend a Short Course about: Scatterometry in Profile, Overlay and Focus Process Control 

Instructors: Hugo Cramer, ASML Netherlands B.V. (Netherlands), Igor Turovets, Nova Ltd (Israel)

February 26 | 1:30-5:30  PM